Qualcomm GSP-1620 Especificaciones Pagina 215

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Integrator’s Reference Manual
7-36 80-99208-1 Rev. D
Non-Operational
The DRA operates as specified after exposure to the
operational and non-operational temperature/humidity
envelopes shown in Figure 7-10.
Thermal Radiation
The temperature profile shown in Figure 7-10 includes
temperature rise due to thermal radiation, solar radiation,
and other heat loads.
Figure 7-10.DRA Temperature/Humidity Envelope
0 5 10 20 30 40 50 60 70 80 90 100
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
85
90
PERCENT RELATIVE HUMIDITY
DRY BULB TEMPERATURE (degrees C)
OPERATIONAL AND NON-OPERATIONAL
ENVELOPE
CONSTANT 40C DEW POINT
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